MA – Investigation into the interdependencies of metal and surface properties on the quality of wire bonds

Metal Ceramic Substrates (here DCB and AMB substrates) are widely used in power electronics. The bonding of thin wires (e.g. down to 50 µm AlSi wires) on DCB Cu surfaces is one of the challenges in addressing next generation power modules.
The aim of this thesis is to investigate the influence of the microstructure and surface roughness of DCB/AMB metallization and respective micro-positioning of bonding wires (e.g. with respect to grain boundaries) on the electrical and mechanical performance of wire bonds. The applicant has to acquire a scientific understanding of wire bonding and will be supervised to gather practical skills in the technique.
Based on this preparation, statistically relevant numbers of samples will be prepared and analyzed. A specific workflow utilizing the broad analytical facilities of IISB for structural (e.g. FIB/electron microscopy, AFM), mechanical (shear and pull tester, nano indentation, strain delineation techniques, thermomechanical stress) and electrical (stress and accelerated reliability testing) characterization will be developed guided by the supervisors.
Basic materials and further application related consultancy will be provided by an industrial partner.

Bearbeiter: Mohamed Ali Abbes

Betreuer: Michael Jank

Verantwortlicher: Prof. Dr.-Ing. Martin März